■ 제품필수정보

제조사	Molex
제조사품명	43650-0212
간략설명	Molex, Micro-Fit 3.0, 43650, 2 Way, 1 Row, Right Angle PCB Header

■ 제품사양

시리즈 = Micro-Fit 3.0
정점 = 3.0mm
연결 수 = 2
행 수 = 1
신체 방향 = Right
앵글 슈라우드/비슈라우드 = Shrouded
커넥터 시스템= Wire to Board
종료 방법 = Solder
접촉 재료 = Brass
Current 등급 = 5.0A Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650
시리즈. Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs. Features and Benefits. High current carrying capacity in a small footprint High temperature housings for IR reflow soldering Positive latching for secure mating connection Fully isolated dual beam terminals for reliable electrical performance and contact Solder tabs for secure connection to PCB Glow Wire Compliant. Product Application Information. These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following: Military COTS (Commercial Off The Shelf) Solar power Consumer products (dryers, freezers, fridges, washing machines) Data communications (routers, servers) Medical Telecommunications Gaming terminals