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MPN : IPG20N10S4L35ATMA1

Dual N-Channel MOSFET Transistor & Diode, 20 A, 100 V, 8-Pin SuperSO8 5 x 6 Infineon IPG20N10S4L35ATMA1
  • 브랜드

    Infineon

  • 무원상품코드

    M011294003379

  • 타입별
    RL
  • 주문가능수량

    14,970

  • 최소주문수량5,000
  • 판매단위5,000
  • 제품정보
  • 배송정보
    (영업일 기준)
  • 특이사항
구매수량 :

*대량구매해택
  • 수량단가1 : 5000개 ~ 839원

  • 수량단가2 : 10000개 ~ 814원

  • 수량단가3 : 20000개 ~ 789원


총금액
(VAT 별도)
  • 상품정보
  • 상품후기
  • 상품문의
  • 배송/AS안내

■ 제품필수정보

제조사 Infineon
제조사품명 IPG20N10S4L35ATMA1
간략설명 Dual N-Channel MOSFET Transistor & Diode, 20 A, 100 V, 8-Pin SuperSO8 5 x 6 Infineon IPG20N10S4L35ATMA1

■ 제품사양

Channel
타입 = N Maximum Continuous Drain Current = 20 A Maximum Drain Source Voltage = 100 V
패키지 = SuperSO8 5 x 6
장착형태 = Surface Mount
핀수 = 8 Maximum Drain Source Resistance = 0.035 O Channel Mode = Enhancement Maximum Gate Threshold Voltage = 16V
칩당 요소 수 = 2
시리즈 = OptiMOS The Infineon offers a wide range of 75V-100V N-channel automotive qualified power MOSFETs using the new OptiMOS technology in various packages a RDS(on) range from 1.2m??up to 190m??Reducing CO2 emissions of passenger cars is accelerating the 48V board net adoption and therefore the 48V like starter generators (main inverter), battery main switches, DCDC converter as well as 48V auxiliaries. For this emerging market, Infineon is offering a broad portfolio of Automotive 80V and 100V MOSFETs, that are housed in different package types like TOLL (HSOF-8), TOLG (HSOG-8), TOLT (HDSOP-16), SSO8 (TDSON-8) and S308 (TSDSON-8), in order to provide solutions for different power requirements as well as different cooling concepts on electronic control unit (ECU) level. The next to 48V applications the 80V and 100V MOSFETs are also used for example in LED lighting, fuel injection as well as in-vehicle wireless charging.Dual N-channel Logic Level - Enhancement mode AEC Q101 qualified MSL1 up to 260°C peak reflow 175°C operating temperature Green Product (RoHS compliant) 100% Avalanche tested Dual Super S08 can replace multiple DPAKs for significant PCB area savings and system level cost reduction. Bond wire is 200um for up to 20A current Larger source lead frame connection for wire bonding Package: PG-TDSON-8-4 Same thermal and electrical performance as a DPAK with the same die size. Exposed pad provides excellent thermal transfer (varies by die size) Two N-Channel MOSFETs in one package with 2 isolated lead frames

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