■ 제품필수정보

제조사	Bopla
제조사품명	35310103
간략설명	Bopla BoLink Series Seal for Use with BoPad 10.1 Enclosures, 291 x 204 x 54.3mm

■ 제품사양

타입 = Seal Length = 291mm For Use With = BoPad 10.1 Enclosures Width = 204mm
크기 = 291 x 204 x 54.3mm
높이 = 54mm
시리즈 = BoLink The Bopla BoLink IoT Enclosure is a sensor enclosure which is made of polycarbonate material. It is a very intelligent and versatile enclosure system for modern IoT sensor technology. The enclosure is available in three variants without wall brackets, with wall brackets, with wall brackets and lid fixing on top. The PC material is suitable for outdoor use due to f1-listing according to UL 746C.IP65 rating UL 94 V0 Fire class Design seal optional