Heatsink, Universal Round Alu, 18.8°C/W, 31.75 (Dia.) x 17.65mm
■ 제품사양
For Use With = Universal Round Alu 높이 = 17.65mm 크기 = 31.75 (Dia.) x 17.65mm Thermal Resistance = 18.8°C/W Diameter = 31.75mm 색상 = Black 패키지 = BGA BGA Heatsink, Radial Fin. Bond-on heatsinks for leadless chip carriers and flat-packs. Primarily designed for 68-pin devices Suitable for high-power LEDs