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제조사	MG Chemicals
제조사품명	8330S-21G
간략설명	MG Chemicals Cold Solder Solid Adhesive, 21 g

■ 제품사양

Adhesive
타입 = Conductive Epoxy Adhesive Application = Thermal Management Material Compatibility = Metal, Plastic Product Form = Solid
패키지 = Syringe Package Size = 21 g Cure Time = 1 h Viscosity Description = High Viscosity
최대 작동 온도 = +150°C Operating Temperature Range = -40 ??+150 °C MG Chemicals Conductive EpoxyThe MG Chemicals 21g silver conductive epoxy is a slow cure electronic grade adhesive that bonds to many substrates that are used in electronics assemblies. The adhesive resists thermal and mechanical shocks and has been designed for production environments when high cure temperatures can damage your heat-sensitive components. It has 0.0007ohm-cm electrical resistivity and 1.75W/(m·K) thermal conductivity.Features and BenefitsCure time of 120 minutes Optimal cure temperature of only 65°C Easy 1:1 mix ratio Versatile High viscosity Cure time of 60 minutes No freezing or dry ice required when shipping or storing Long shelf life Excellent water and chemical resistance Effective for gap filling between metal plates Excellent adhesion to most electronic substrates Strong water and chemical resistanceApplicationsUse for repair and assembly in optoelectronics and microelectronics Aerospace Marine communication Industrial control equipment industriesCertificationsRoHS certified REACH compliant ANSI/ESD S20.20:2014 BS EN 61340-5-1:2007