■ 제품필수정보

제조사	Bergquist
제조사품명	HF650P-0.001-01-00-122
간략설명	Thermal Interface Pad, Hi-Flow 650P, 1.5W/m·K 0.001in, Self-Adhesive

■ 제품사양

Thickness = 0.001in Thermal Conductivity = 1.5W/m·K Material = Hi-Flow 650P Self-Adhesive = Yes
최소 작동 온도 = -40°C
최대 작동 온도 = +150°C Material Trade Name = Hi-Flow 650P Operating Temperature Range = -40 ??+150 °C Hi-Flow 650P. Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules. Thermal Impedance: 0.20°C-in2/W (@25 psi) 150°C high temperature reliability Natural tack one side for ease of assembly Exceptional thermal performance in an insulated pad