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MPN : GP2500S20-0.200-02-00-100x100

Thermal Interface Sheet, Gap Pad 2500S20, 2.4W/m·K, 100 x 100mm 0.2in, Self-Adhesive
  • 브랜드

    Bergquist

  • 무원상품코드

    M012103005457

  • 타입별
    EA
  • 주문가능수량

    품 절

  • 최소주문수량1
  • 판매단위1
  • 제품정보
  • 배송정보
    (영업일 기준)
  • 특이사항
구매수량 :

*대량구매해택
  • 수량단가1 : 1개 ~ 138,900원


총금액
(VAT 별도)

  • 상품정보
  • 상품후기
  • 상품문의
  • 배송/AS안내

■ 제품필수정보

제조사 Bergquist
제조사품명 GP2500S20-0.200-02-00-100x100
간략설명 Thermal Interface Sheet, Gap Pad 2500S20, 2.4W/m·K, 100 x 100mm 0.2in, Self-Adhesive

■ 제품사양


크기 = 100 x 100mm Thickness = 0.2in Length = 100mm Width = 100mm Thermal Conductivity = 2.4W/m·K Material = Gap Pad 2500S20 Self-Adhesive = Yes
최소 작동 온도 = -60°C
최대 작동 온도 = +200°C Hardness = Shore OO 20 Material Trade Name = Gap Pad 2500S20 Operating Temperature Range = -60 ??+200 °C Bergquist Gap Pad® 2500S20. Bergquist Gap Pad® 2500S20 is a thermally conductive, reinforced material rated at a thermal conductivity of 2.4 W/m-K. The material is a filled-polymer material yielding extremely soft, elastic characteristics. The material is reinforced to provide easy handling and converting, added electrical isolation and tear resistance. Berqquist Gap Pad® 2500S20 is well suited for low-pressure applications that typically use fixed standoff or clip mounting. The material maintains a conformable, yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. Bergquist Gap Pad® 2500S20 is offered with inherent natural tack on both sides of the material allowing for stick-in-place characteristics during application assembly. The material is supplied with protective liners on both sides. The top side has reduced tack for ease of handling. Typical applications include between processors and heat sinks, between graphics chips and heat sinks, DVD and CD-ROM electronics cooling and areas where heat needs to be transferred to a frame, chassis or other type of heat spreader. Thermal conductivity: 2.4 W/m-K Low "S-Class" thermal resistance at ultra-low pressures Ultra conformable, gel-like modulus Designed for low-stress applications Fibreglass reinforced for puncture, shear and tear resistance

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