■ 제품필수정보

제조사	Sick
제조사품명	UD18-22CC221
간략설명	Sick Ultrasonic Barrel-Style Proximity Sensor, M18 x 1, 20 ??60 mm Detection, PNP Output, 20 ??30 V, IP65

■ 제품사양

Sensor Technology = Ultrasonic Thread Size = M18 x 1 Output
타입 = PNP Detection Range = 20 ??60 mm Terminal
타입 = Cable Supply Voltage = 20 ??30 V Length = 63.2mm Width = 18mm Maximum DC Voltage = 30V Switching Current = 200 mA Housing Material = Metal
최소 작동 온도 = +5 °C OverviewAt a glanceMaterial classifications: no layers, single layer, double layers Plug-and-play sensitivity levels that can be selected, taught in, and changed during operation Up to four individual sensitivity levels Variable mounting distance LEDs visible from any direction Immune to dirt, dust, and humidityYour BenefitMaximum productivity and quality thanks to reliable material transportation monitoring Rapid commissioning thanks to plug-and-play plus a range of sensitivity levels to choose from Easy to switch between sensitivity levels during operation, preventing downtimes during material changes Individual teach-in of various materials, making it possible to tackle even the most demanding applications The utmost flexibility during installation thanks to variable mounting distance LEDs visible from any direction, making it easy to monitor double sheet detections Reliable detection in dirty, dusty, and humid conditions thanks to the ultrasonic technologys immunity to these environmentsThe UD18-2 specializes in checking for double layers and splices using ultrasonic technology. Operating with precision, it is able to determine whether one, two or no material layers are present between its sender and receiver. Where the UD18-2 really excels is checking for double layers in paper, cardboard, shiny metal, and transparent plastic. It is possible to teach in up to four sensitivity levels and switch between them during operation, allowing the sensor to tackle even the most complex of applications and ensure permanent system availability with a consistently excellent level of production quality.ApplicationsDouble layer detection for paper, cardboard, film, sheet metal, wafers, PCBs, and chip cards Checking material transportation upstream of presses, printing machines, and cutting machines Splice and label detection Packaging, processing, printing, paper, electronics, solar, metal, automotive, and supply industries Double layer detection when splicing Double-sheet detector Double layer detection of solar wafers in cell production