■ 제품필수정보

제조사	Bopla
제조사품명	16174365.HMT1
간략설명	Bopla BoLink Series Polycarbonate Enclosure, 70.4 x 42.4 x 15.5mm
문서자료	https://documents.rs-online.com/techlib:/itc_doclist_GB.htm?stockno=2005419

■ 제품사양

Body Material = Polycarbonate External Length = 70.4 mm External
높이 = 15.5 mm External Width = 42.4 mm External
크기 = 70.4 x 42.4 x 15.5mm Flanged = No Shielded = No
시리즈 = BoLink The Bopla BoLink IoT Enclosure is a sensor enclosure which is made of polycarbonate material. It is a very intelligent and versatile enclosure system for modern IoT sensor technology. The enclosure is available in three variants without wall brackets, with wall brackets, with wall brackets and lid fixing on top. The PC material is suitable for outdoor use due to f1-listing according to UL 746C.IP65 rating UL 94 V0 Fire class Design seal optional