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Product Material = Epoxy
패키지 = Pack Package Size = 500 g Cure Time = 24 ??48 h Hardness = 80 Shore D
색상 = Amber
최대 작동 온도 = +120°C
최소 작동 온도 = -40°C Operating Temperature Range = -40 ??+120 °C Properties quoted are for 1:1 mix ratio by weight. A measure of flexibility may be introduced to the compound without impairing its electrical properties by adding more hardener to the mix: this will also improve the adhesion and act as a vibration damper. Epoxy Potting Compound. From RS PRO a high quality two-part clear amber epoxy resin encapsulation and potting compound. This epoxy potting compound provides a tough coating around your electrical components offering good protection from chemicals and water as well as having good electrical properties. One of the main features of this epoxy potting compound is an ability to adhere to a wide range of materials. Once applied, a strong bond is formed which is maintained even in harsh conditions. When this epoxy compound cures it forms a tough resin, however, flexibility can be adjusted by decreasing the amount of hardener when mixed which should be carried out after careful testing. This clear amber epoxy compound can be used as both a potting compound and an adhesive making it both versatile and cost-effective. What is Epoxy Resin Potting Compound?. A semi-rigid potting compound, useful for encapsulating or adhering materials of different coefficients of thermal expansion, e.g. glass, metal, ceramics and many plastic materials. Features and Benefits. Can be used as an adhesive. What is this Epoxy Resin Potting Compound Used For?. Cure time: 24 - 48 hours @23 °C; 1 hour @100 °C The compound can be handled as a gel after 4 hours, but full properties are developed after 24-48 hours. Whats in the Kit?. This epoxy potting compound is supplied in a kit consisting of two components; a can containing 250g of resin and a 250g can of hardener. Each kit is supplied with full instructions for use. How do you Apply Potting Compound?. Before applying this epoxy potting compound it is important that any residue or contaminants are removed from the electronic components prior to potting. The electronic assembly is placed inside a mould called ??The pot ?? This mould is then filled with the mixed potting compound that hardens and permanently protects the assembly. Circuit boards can also be potted and are often called ??potted ??PCBs. These circuit boards have high walled sides forming an enclosure with the mounted electronic components sitting inside. The potting compound is then poured into this enclosure.
