■ 제품필수정보

제조사	STMicroelectronics
제조사품명	STM32MP157AAA3
간략설명	STMicroelectronics STM32MP157AAA3 ARM Cortex A7, ARM Cortex M4 Microcontroller, STM32MP1, 650MHz LFBG

■ 제품사양

패밀리명 = STM32MP1
패키지 = LFBG
코어 = ARM Cortex A7, ARM Cortex M4
최대 주파수 = 650MHz
RAM 크기 = 256 kB ADCs = 2x 16-bit The STM32MP157A devices are based on the high-performance dual-core Arm® Cortex®- A7 32-bit RISC core operating at up to 650 MHz. The Cortex-A7 processor includes a 32- Kbyte L1 instruction cache for each CPU, a 32-Kbyte L1 data cache for each CPU and a 256-Kbyte level2 cache. The Cortex-A7 processor is a very energy-efficient application processor designed to provide rich performance in high-end wearables, and other lowpower embedded and consumer applications. It provides up to 20% more single thread performance than the Cortex-A5 and provides similar performance than the Cortex-A9. The Cortex-A7 incorporates all features of the high-performance Cortex-A15 and CortexA17 processors, including virtualization support in hardware, NEON?? and 128-bit AMBA®4 AXI bus interface. The STM32MP157A devices also embed a Cortex® -M4 32-bit RISC core operating at up to 209 MHz frequency. Cortex-M4 core features a floating point unit (FPU) single precision which supports Arm® single-precision data-processing instructions and data types. The Cortex® -M4 supports a full set of DSP instructions and a memory protection unit (MPU) which enhances application security. The STM32MP157A devices also embed a 3D graphic processing unit (Vivante® - OpenGL® ES 2.0) running at up to 533 MHz, with performances up to 26 Mtriangle/s, 133 Mpixel/s. The STM32MP157A devices provide an external SDRAM interface supporting external memories up to 8-Gbit density (1 Gbyte), 16 or 32-bit LPDDR2/LPDDR3 or DDR3/DDR3L up to 533 MHz. The STM32MP157A devices incorporate high-speed embedded memories with 708 Kbytes of Internal SRAM (including 256 Kbytes of AXI SYSRAM, 3 banks of 128 Kbytes each of AHB SRAM, 64 Kbytes of AHB SRAM in backup domain and 4 Kbytes of SRAM in backup domain), as well as an extensive range of enhanced I/Os and peripherals connected to APB buses, AHB buses, a 32-bit multi-AHB bus matrix and a 64-bit multi layer AXI interconnect supporting internal and external memories access.