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MPN : TBS20S

Electrolube TBS20S Paste Thermal Adhesive, 20 ml
  • 브랜드

    Electrolube

  • 무원상품코드

    M010648005139

  • 타입별
    EA
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■ 제품필수정보

제조사 Electrolube
제조사품명 TBS20S
간략설명 Electrolube TBS20S Paste Thermal Adhesive, 20 ml

■ 제품사양

Adhesive
타입 = Thermal Adhesive Application = Thermal Management Material Compatibility = Metal, Plastic Product Form = Paste
패키지 = Syringe Package Size = 20 ml Cure Time = 48 h
최대 작동 온도 = +120°C
최소 작동 온도 = -40°C Electrolube Thermal Bonding System. The TBS (thermal bonding sytsem) from Electrolube is a two part, thermally conductive epoxy system perfect for the thermal coupling of electrical and electronic components, or between any surface where thermal conductivity or heat dissipation is vital. The Electrolube thermal bonding system features metal oxides that provide high quality thermal conductivity whilst being electrically insulating. This versatile TBS offers a wide operating range of -40°C to + 120°C, allowing you to work with a variety of applications. The two part epoxy system is quick and easy to mix, with a usable life of 3 to 4 hours once mixed and is ideal for room temperature curing if required. Features and benefits. Wide operating range of -40°C to +120°C, ideal for use with a variety of applications Excellent bond and adhesion strength, eliminating the need for welding techniques Excellent thermal conductivity even at high temperatures Room temperature curing, with shorter rates achievable at higher temperatures Easy to mix blue (A) and cream (B) coloured parts, with a 3:1 (A:B) mixing ratio High thermal conductivity: 1.10 W/m.K. Application. Thermal adhesives are a type of thermally conductive adhesive used to secure heat sinks and electronic components. Thermal adhesives are available in a number of mediums such as thermal paste, glue, tape and more. They work by creating a strong bond for heatsinks or electrical parts commonly via a two-part epoxy resin. with thermal conductivity capabilities, drawing heat away from a device. Thermal adhesives are used in a variety of industries and applications such as: Heat sink bonding Potting/encapsulating sensors BGA die heat spreader interface Chip scale packages Power semiconductors. How to apply. Before applying, ensure surfaces are clean and free from grease, dust and contaminants. Begin by mixing the two parts of the compound together as per the mix ratio. Once mixed, apply a thin film, to the base and mounting studs of many component types including diodes, transistors, thyristors, heatsinks, silicone rectifiers, semiconductors, thermostats, power resistors and radiators. Can this thermal adhesive be removed?. Thermal adhesives such as grease and pastes can be removed if required using a combination of a thermal adhesive remover (or high concentrate rubbing alcohol) and a lint free micro fibre cloth. Please note special care must be taken when removing thermal compounds and protective clothing must be worn at all times. What is the maximum operating temperature?. The maximum operating temperature of this thermal compound is +120°C.

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