Heatsink, Universal Round Alu, 23.4°C/W, 28.58 (Dia.) x 9.14mm
■ 제품사양
For Use With = Universal Round Alu 높이 = 9.14mm 크기 = 28.58 (Dia.) x 9.14mm Thermal Resistance = 23.4°C/W Diameter = 28.58mm 색상 = Black 패키지 = BGA BGA Heatsink, Radial Fin. Bond-on heatsinks for leadless chip carriers and flat-packs. Primarily designed for 68-pin devices Suitable for high-power LEDs